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EM-6520半自动探针仪

Wafer dimeter, max       200 mm
Die size, max        20х20 mm
Contact accuracy       +-10 mkm
Object table heating temperature (EМ-6520) up to 150° С
Vacuum          0.04-0.03 MPa
Power consumption and requirements   230 V, 50 Hz, 0.8 КW
Overall dimensions, max      800х700х1600 mm
Weight, max         300 kg

 

EM-6520, EМ-6520-1 Semiautomatic Probers are designed for contacting of IC and VLSI on wafers with the diameter 200 mm in the range of normal and high temperatures.
The probes provide:
– electrical contact between probes and contact pads of chips on wafer;
– wafer tracing according to the traditional “line by line” method and through the basic points programmed relatively to the basic die;
– yield mapping of test results;
– output of the test results on the display;
– output of the test results on the periphery device;
– die marking with ink.
The electronic devices and software ensure teaching from another device directly on the system, the parameters being saved in system’s memory, for work under conditions of multinomenclate production.

Wafer dimeter, max                          200 mm

Die size, max                               20х20 mm

Contact accuracy                            +-10 mkm

Object table heating temperature (EМ-6520)  up to 150° С

Vacuum                                      0.04-0.03 MPa

Power consumption and requirements          230 V, 50 Hz, 0.8 КW

Overall dimensions, max                     800х700х1600 mm

Weight, max                                 300 kg

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